Leading Resin Manufactuer

Custom Adhesives&Encapsulants for Industry

Leading Resin Manufactuer

Custom Adhesives&Encapsulants for Industry

 

Board Level Underfill Adhesives for Consumer Electronics

 

To help manufacturers address the challenges within specific industries, Sino Resins has the most robust range of underfills. Our innovative capillary flow, edge, and corner bond underfills for CSP, BGA, WLCSP, LGA and other similar devices lower stress, improve reliability, and offers outstanding results.

 

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